Redesigning LED Packaging by Bryant Lee

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Redesigning LED Packaging is Bryant Lee's Senior Thesis at the School of Art & Design at the University of Michigan and is a project featured on The Die Line.

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Bryant utilized the laser cutter to create different design iterations for the packaging, some of which can be seen in the image below.

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Ultimately the final design utilized laser cutting perforation to create a collapsible structure that was used for protective padding and perforation to create a hexagonal prism for the outer packaging container. This project illustrates the importance of revision iterations in the design process.

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