Area Array Packaging Handbook
By: Gilleo, K., 2002 McGraw-Hill
This book covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications.
Surface Engineering for Corrosion and Wear Resistance
Publisher: Woodhead Publishing, 2001
Author/Editor: : Davis, J.R.
Description: Engineers are faced with a bewildering array of choices when selecting a surface treatment for a specific corrosion or wear application. This book provides practical information to help them select the best possible treatment. An entire chapter is devoted to process comparisons, and dozens of useful tables and figures compare surface treatment thickness and hardness ranges; abrasion and corrosion resistance; processing time, temperature, and pressure; costs; distortion tendencies; and other critical process factors and coating characteristics.
Introduction to Electronic Defense Systems (2nd Edition)
By: Neri, Filippo, 2006 SciTech Publishing
This book explores a broad spectrum of defense equipment, explains how these systems operate, the advantages and drawbacks of each system, and the theories on which these systems are based.
Medical Imaging Systems Technology - Modalities
Edited by: Leondes, Cornelius T., 2005 World Scientific
This scholarly set of well-harmonized volumes provides indispensable and complete coverage of the exciting and evolving subject of medical imaging systems.