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'Area Array Packaging Handbook' in Knovel


Area Array Packaging Handbook
By: Gilleo, K., 2002 McGraw-Hill
This book covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications.

Posted by U of M Lib Science and Engineering Lib on August 25, 2006 08:40 PM |

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